DEVELOPMENT OF THE CBM-MVD: THE PROTOTYPE Michal Koziel on behalf of CBM-MVD collaboration
[email protected]
(+49) 069 / 798-47119
The MVD – required performances
See P.Senger introduction
CBM-MVD will: - improve secondary vertex resolution - host highly granular silicon pixel sensors featuring fast read-out, excellent spatial resolution and robustness to radiation environment.
Required performances (SIS-100) Radiation tolerance
> 1013neq/cm2 & >3 MRad
Read-out speed
> 30 kframes/s
Intrinsic resolution
< 5 µm
Operation in vacuum „Light” support and cooling
Material budget ~ 0.3 % X0
Radiation tolerance Support & cooling
M.Winter Main challenges:
• Provide fast and radiation tolerant sensor featuring low material budget • Develop sensor readout system capable to handle high data rates • Provide cooling and support with low material budget
Front-End Electronics
J.Stroth
System integration
Sensor development
Prototype Demonstrator
4 sensors
½ of 1st station
Final ...will meet all requirements
Sensor:
Sensor:
Sensor:
MIMOSA-20 ~200 frames/s few 1011 neq/cm2 & ~300 kRad 750µm thick
MIMOSA-26 AHR ~10 kframes/s ~1013 neq/cm2 & >300 kRad 50µm thick
MIMOSIS-1 (diff. geometry)
Readout
Readout
Serial/analog
CP/digital/high data rates
>1013 neq/cm2 & >3 MRad
Cooling & support:
Cooling & support:
TPG+RVC foam
CVD diamond
Material budget: ~ 2.45 % X0
Material budget: ~ 0.3 % X0
Readout speed ~30 kframes/s
Radiation tol.
MIMOSA-26 AHR 0.35µm process High Resistivity (HR) EPI (400Ω·cm) 21.2 x 10.6 mm2 Main features: 18.4 µm pixel pitch - in pixel amplification - comparator for each column - 0 suppression logic - pitch: 18.4 μm∼ 0.7 million pixels CMOS processes with smaller feature size (0.18µm) Radiation tolerance
Achieved performances MIMOSA-26 AHR (2009) [1]
Design goals (SIS-100) MIMOSIS-1 (~2015)
~1013neq/cm2 & >300 kRad
~1013neq/cm2 & >3 MRad
CMOS~10 processes kframes/swith smaller feature size (0.18µm) Intrinsic resolution ~3.5 µm Sensor geometry – column Material budget ~ 0.05 % X0 (50µm Si) length Read-out speed
>30 kframes/s < 5 µm ~ 0.05 % X0 (50µm Si)
Extensively studied at IKF: [1] M.Deveaux „Radiation tolerance of a column parallel CMOS sensor with high resistivity epitaxial layer”, accepted for publication in Journal Of Instrumentation 2011
Driver board
Clk Start Reset JTAG
CB
FEB
5 x 800MBit/s multiwire LVDS
Signal distribution Filtering
RCB
multiwire 5 x 1GBit/s LVDS Optical Fibers
Powering Powering LVDS drivers Latchup detection Current&& Current temperature temperature monitoring monitoring LVDS to Optical conversion
PEXOR
PC
PCI optical receiver 15 optical x 300MBit/s link Optical Fibers
CBM DAQ Data reduction Time stamping Slow control Fast control LVDSconcentrator to Optical Data
FEB – Front End Board // CB – Converter Board // RCB – Readout Controller Board
Main objectives: On-line current monitoring Latch-up detection & handling (based on STAR solution) Possibility to use radiation tolerant components (CERN)
Slow control
Cooling
Cooling & carrier
*
Heat Sink
Heat Sink
Carrier * - @ +20C , >3000W/mK @-50C
Demonstrator Sensor
Prototype
Flex Cable
Sensor
Flex Cable R/O
TPG RVC TPG
Cu heat sink
750µm thick sensors
TPG - Thermal Pyrolitic Graphite
CVDD 300µm
R/O Sensors thinned down to 50µm
R/O
Material budget ~2.45% X0
R/O Cu heat sink
Material budget ~0.35% X0
RVC - Reticulated Vitreous Carbon
Flex Cable Sensor CVDD 300µm
R/O Cu heat sink R/O
SERWIETE (SEnsor Row Wrapped In an Extra Thin Envelope) IMEC (Belgium) + IKF Frankfurt + IPHC Strasbourg (sensors)
Radiation tolerance ? Reliability ? Thermal cycles ? Real material budget ?
Digital Microscope Keyence VHX-600
Thermal imaging system (VarioCAM HiRes 640)
Probe Station PA200 (Suss-Microtec)
10-7 mBar vacuum chamber
1) 2) 3) 4) 5) 6)
The concept of the MVD read-out is defined The hardware components for MVD prototye have been delivered to the IKF Assembly and debugging in progress Software development is ongoing Lab tests to be performed In parallel – software developments
Challanges: 1) Deliver MIMOSIS-1 – with required radiation tolerance & readout speed for MVD 2) Most optimum read-out 3) Connectivity 4) Second station – large area sensors…
CBM-MVD Collaboration members: Samir Amar-Youcef, Norbert Bialas, Michael Deveaux, Dennis Doering, Melissa Domachowski, Christina Dritsa, Horst Düring, Ingo Fröhling, Tetyana Galatyuk, Michal Koziel, Jan Michel, Boris Milanovic, Christian Müntz, Bertram Neumann, Paul Scharrer, Christoph Schrader, Selim Seddiki, Joachim Stroth, Tobias Tischler, Christian Trageser, Bernhard Wiedemann Jérome Baudot, Grégory Bertolone, Nathalie Chon-Sen, Gilles Claus, Claude Colledani, Andrei Dorokhov, Wojchiech Dulinski, Marie Gelin-Galivel, Mathieu Goffe, Abdelkader Himmi, Christine Hu-Guo, Kimmo Jaaskelainen, Frédéric Morel, Fouad Rami, Mathieu Specht, Isabelle Valin, Marc Winter
